US Patent Issued to Sandisk Technologies on July 14 for "Selective wire coating during wire bonding" (Malaysian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,229, issued on July 14, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Selective wire coating during wire bonding" was invented by Darryl Wong Jun Chen (Kuching, Malaysia), Jiun Dong Loeh (Bayan Lepas, Malaysia) and Muhammad Farhan Taufiq Mohamad Helmi (P. Klang, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device wherein a selected subset of bond wires is coated with an electrically insulating polymer to reduce occurrences of electrical shorts caused by wire sweep in the flow of a molding compound during an encapsulation stage of the manufacturing process. In some examples, the bond wires to be coated are ...