US Patent Issued to SANDISK TECHNOLOGIES on Jan. 20 for "Semiconductor device package with coupled substrates" (Indian Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,777, issued on Jan. 20, was assigned to SANDISK TECHNOLOGIES INC. (Milpitas, Calif.).

"Semiconductor device package with coupled substrates" was invented by Rohith Kamath (Bangalore, India), Amit Vijayvargiya (Bangalore, India), Shankara Venkatraman Gopalan (Bangalore, India) and Shankar AB (Bengaluru, India).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a first substrate extending along a first central plane, and a second substrate electrically connected to the first substrate and extending along a second central plane that is substantially parallel with and offset from the first central plane of the first su...