US Patent Issued to Sandisk Technologies on Feb. 17 for "Vertically mountable snap fit bracket for electrolytic capacitors" (Chinese, American Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,955, issued on Feb. 17, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Vertically mountable snap fit bracket for electrolytic capacitors" was invented by Shiqiang Sun (Shenzhen, China), Lihwa Fong (Irvine, Calif.) and Ning Ye (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A snap fit bracket for an electrolytic capacitor is vertically mounted within an opening defined by a substrate. The bracket includes four sidewalls that form a perimeter. A first flange extends from one sidewall and forms a first ledge that sits on a top surface of the substrate when the bracket is mounted within the opening defined by the substra...