US Patent Issued to Sandisk Technologies on Dec. 23 for "Dicing and wafer thinning to form semiconductor dies" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,036, issued on Dec. 23, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Dicing and wafer thinning to form semiconductor dies" was invented by Zhengjie Zhu (Shanghai), Junrong Yan (Shanghai), Chee Keong Chin (Shanghai), Cheng Chang (Shanghai) and Zhonghua Qian (Shanghai).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die is separated from a semiconductor wafer using a method that involves performing a partial cut on the semiconductor wafer, applying tape lamination to a front side of the semiconductor wafer, grinding a back side of the semiconductor wafer, mounting the semiconductor wafer to a die attach film (DAF) layer...