US Patent Issued to Sandisk Technologies on April 7 for "Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings" (California Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,752, issued on April 7, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Method of making a three-dimensional memory device using composite hard masks for formation of deep via openings" was invented by Rahul Sharangpani (Fremont, Calif.), Senaka Kanakamedala (San Jose, Calif.), Raghuveer S. Makala (Campbell, Calif.), Roshan Jayakhar Tirukkonda (Milpitas, Calif.) and Kartik Sondhi (Milpitas, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a structure includes forming an alternating stack of first material layers and second material layers over a substrate; forming an etch mask material layer containing an open...