US Patent Issued to Sandisk Technologies on April 21 for "Shock absorber assembly for a printed circuit board" (Malaysian, American Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,455, issued on April 21, was assigned to Sandisk Technologies Inc. (Milpitas, Calif.).

"Shock absorber assembly for a printed circuit board" was invented by MyungJin Kim (Santa Clara, Calif.), Fu Xing Chan (Penang, Malaysia), Chun Sean Lau (Penang, Malaysia) and Lihwa Fong (Irvine, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A shock absorber for a printed circuit board (PCB) includes a first portion and a second portion. The first portion is positioned on a first side of the PCB at or near a connector that extends from the PCB. The second portion is positioned on a second side of the PCB, opposite the first portion. The first and second p...