ALEXANDRIA, Va., April 15 -- United States Patent no. 12,603,635, issued on April 14, was assigned to Sanan Japan Technology Corp. (Tokyo).
"Acoustic wave device and module" was invented by Yuki Koto (Tokyo) and Shinichi Shioi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic wave device includes a wiring substrate, a wiring substrate-side wiring formed on the wiring board, a chip substrate opposed to the wiring substrate, a chip substrate-side wiring formed on the chip substrate, a plurality of resonators formed on the chip substrate and electrically connected to the chip substrate-side wiring, a plurality of bumps electrically connected to the wiring substrate-side wiring and the chip subst...