US Patent Issued to SAN-EI KAGAKU on Sept. 9 for "Via wiring formation substrate, manufacturing method for via wiring formation substrate, and semiconductor device mounting component" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,859, issued on Sept. 9, was assigned to SAN-EI KAGAKU Co. LTD. (Tokyo).

"Via wiring formation substrate, manufacturing method for via wiring formation substrate, and semiconductor device mounting component" was invented by Hiroyuki Kurihara (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A via wiring formation substrate for mounting at least one semiconductor chip, the substrate including a support substrate, a releasable adhesive layer provided on the support substrate, a first insulating layer provided on the releasable adhesive layer, and a second insulating layer laminated on the first insulating layer, wherein the first insulating layer ...