US Patent Issued to SAMTEC on Jan. 20 for "Method and apparatus for testing a die package assembly" (Indiana, Maine Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,383, issued on Jan. 20, was assigned to SAMTEC INC. (New Albany, Ind.).

"Method and apparatus for testing a die package assembly" was invented by Brandon Thomas Gore (New Albany, Ind.), Richard Mellitz (New Albany, Ind.), Gauss Yang (New Albany, Ind.), Kelly Garrison (New Albany, Ind.) and Norman S. Mcmorrow (Brunswick, Maine).

According to the abstract* released by the U.S. Patent & Trademark Office: "A twinaxial cable splitter is in electrical communication with an IC die package. First and second coaxial electrical cables are configured to route electrical signals to a testing device that is configured to determine certain metrics of an IC chip of the die package. Thus, a meth...