US Patent Issued to SAMTEC on Dec. 2 for "Vertical insertion interconnection system with ring connector for high-speed data transmission" (California Inventor)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,487,419, issued on Dec. 2, was assigned to SAMTEC INC. (New Albany, Ind.).

"Vertical insertion interconnection system with ring connector for high-speed data transmission" was invented by Eric Zbinden (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnect module and mating ring connector are described. The interconnect module may be a transceiver, transmitter, or receiver that is part of an optical communication system. The interconnect module has a low profile and small footprint. The interconnection system is capable of transferring information at high data rates."

The patent was filed on Oct. 13, 2021, under Application N...