US Patent Issued to SAMSUNG SDI on May 12 for "CMP slurry composition for patterned tungsten wafer and method of polishing patterned tungsten wafer using the same" (South Korean Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,624,251, issued on May 12, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea).

"CMP slurry composition for patterned tungsten wafer and method of polishing patterned tungsten wafer using the same" was invented by Ji Ho Lee (Suwon-si, South Korea), Young Gi Lee (Suwon-si, South Korea), Soo Yeon Sim (Suwon-si, South Korea), Hyun Woo Lee (Suwon-si, South Korea) and Jong Won Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A CMP slurry composition for patterned tungsten wafers and a method of polishing patterned tungsten wafers using the same, the CMP slurry composition includes a solvent; an abrasive; and a non-dendrimeri...