US Patent Issued to SAMSUNG SDI on June 16 for "Compound, CMP slurry composition including the same and polishing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,655,321, issued on June 16, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea).

"Compound, CMP slurry composition including the same and polishing method using the same" was invented by Se Young Choi (Suwon-si, South Korea), Yong Goog Kim (Suwon-si, South Korea), Soo Yeon Sim (Suwon-si, South Korea), Ja Young Hwang (Suwon-si, South Korea), Jeong Hee Kim (Suwon-si, South Korea) and Youn Jin Cho (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A compound or a salt thereof, a CMP slurry composition including the same, and a polishing method using the same, the compound being represented by Formula 1,"

The patent was filed o...