US Patent Issued to SAMSUNG SDI on Feb. 3 for "CMP slurry composition for polishing copper and copper film polishing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,256, issued on Feb. 3, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea).

"CMP slurry composition for polishing copper and copper film polishing method using the same" was invented by Soo Yeon Sim (Suwon-si, South Korea), Ji Ho Lee (Suwon-si, South Korea), Yong Goog Kim (Suwon-si, South Korea), Se Young Choi (Suwon-si, South Korea), Ja Young Hwang (Suwon-si, South Korea) and Jeong Hee Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A CMP slurry composition for polishing copper and a copper film polishing method using the same, the CMP slurry composition includes a solvent; an abrasive agent; and a compound includ...