US Patent Issued to SAMSUNG SDI on Feb. 17 for "CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,552,962, issued on Feb. 17, was assigned to SAMSUNG SDI Co. LTD. (Yongin-si, South Korea).

"CMP slurry composition for polishing tungsten pattern wafer and method of polishing tungsten pattern wafer using the same" was invented by Tae Won Park (Suwon-si, South Korea), Jin Gyo Kim (Suwon-si, South Korea), Ji Ho Lee (Suwon-si, South Korea), Eui Rang Lee (Suwon-si, South Korea) and Dong Hyeon Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A CMP slurry composition for polishing a tungsten pattern wafer and a method of polishing a tungsten pattern wafer, the CMP slurry composition includes a solvent; an abrasive agent containing si...