US Patent Issued to Samsung SDI, SAMSUNG ELECTRONICS on Feb. 17 for "Resist topcoat composition, and method of forming patterns using the composition" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,554,199, issued on Feb. 17, was assigned to Samsung SDI Co. Ltd. (Yongin-si, South Korea) and SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Resist topcoat composition, and method of forming patterns using the composition" was invented by Ran Namgung (Suwon-si, South Korea), Hyeon Park (Suwon-si, South Korea), Minsoo Kim (Suwon-si, South Korea), Daeseok Song (Suwon-si, South Korea), Minki Chon (Suwon-si, South Korea), Jun Soo Kim (Hwaseong-si, South Korea), Hyun-Woo Kim (Seongnam-si, South Korea), Hyun-Ji Song (Anyang-si, South Korea), Young Joo Choi (Hwaseong-si, South Korea) and Suk-Koo Hong (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent ...