US Patent Issued to SAMSUNG ELECTRONICS on Sept. 9 for "Organometallic adduct compound and method of manufacturing integrated circuit using the same" (South Korean, Japanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,410,203, issued on Sept. 9, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Organometallic adduct compound and method of manufacturing integrated circuit using the same" was invented by Seungmin Ryu (Hwaseong-si, South Korea), Jaewoon Kim (Seoul, South Korea), Gyuhee Park (Hwaseong-si, South Korea), Younjoung Cho (Hwaseong-si, South Korea), Kazuya Saito (Tokyo), Takanori Koide (Tokyo), Yoshiki Manabe (Tokyo), Yutaro Aoki (Tokyo), Hiroyuki Uchiuzou (Tokyo) and Wakana Fuse (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An organometallic adduct compound and a method of manufacturing an integrated circuit (IC) device, the orga...