US Patent Issued to SAMSUNG ELECTRONICS on Sept. 9 for "Method of predicting characteristic of semiconductor device and computing device performing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,013, issued on Sept. 9, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Method of predicting characteristic of semiconductor device and computing device performing the same" was invented by Jonghyun Lee (Hwaseong-si, South Korea), Gwangnae Gil (Yongin-si, South Korea), Seyoung Park (Hwaseong-si, South Korea) and Sola Woo (Gwacheon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "To predict characteristics of a semiconductor device, a simulation current-voltage curve of the semiconductor device is generated using compact models where each compact model generates simulation result data by performing a simulatio...