US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Substrate processing tube, substrate processing apparatus including the same, and substrate processing method using the apparatus" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,747,497, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing tube, substrate processing apparatus including the same, and substrate processing method using the apparatus" was invented by Hyunju Lee (Suwon-si, South Korea), Byeonghoon Kim (Suwon-si, South Korea), Hyouncheol Kim (Suwon-si, South Korea), Jaehyung Lee (Suwon-si, South Korea) and Byunghwan Kong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus may include an inner tube providing a process space extending vertically, an outer tube enclosing the inner tube, a gas supplying conduit ...