US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,315, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Injae Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate extending in a first direction, the package substrate having at least one first opening in a chip mounting region of the package substrate; a first semiconductor chip mounted in the chip mounting region on an upper surface of the package substrate; a plurality of second semiconductor chips sequentially stacked on the upper surface o...