US Patent Issued to SAMSUNG ELECTRONICS on Sept. 29 for "Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,746,638, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Retainer ring, chemical mechanical polishing apparatus, and substrate polishing method" was invented by Sangyun Lee (Suwon-si, South Korea) and Younghun Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a retainer ring, a chemical mechanical polishing apparatuses including the same, and a substrate polishing method using the same. A slurry groove is upwardly recessed from a bottom surface of the retainer ring. The slurry groove extends in an arc shape from an inner surface of the retainer ring toward an outer surface o...