ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,301, issued on Sept. 29, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Miniaturized high-capacity semiconductor package" was invented by Hye Jin Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate including a first wiring pattern, a redistribution layer disposed on an upper surface of the substrate, a solder resist layer disposed on an upper surface of the redistribution layer and including a second recess formed inside the solder resist layer, a first conductive terminal disposed on sidewalls and a bottom surface of the second recess, a first solder ball di...