US Patent Issued to SAMSUNG ELECTRONICS on Sept. 23 for "Method and apparatus for performing feedback-based ethernet header compression or decompression in wireless communication system" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,425,917, issued on Sept. 23, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method and apparatus for performing feedback-based ethernet header compression or decompression in wireless communication system" was invented by Donggun Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a communication technique for converging IoT technology with a 5G communication system for supporting a higher data transfer rate beyond the 4G system, and a system thereof. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smar...