US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor device and semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,742,817, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and semiconductor package" was invented by Donguk Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device including a first transmission pad configured to output a data signal; a second transmission pad configured to output a clock signal; a data transmission circuit connected to the first transmission pad and comprising a data driver configured to generate the data signal; a clock transmission circuit connected to the second transmission pad and comprising a clock driver configur...