US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Electrostatic chuck" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,741,349, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electrostatic chuck" was invented by Inseok Seo (Suwon-si, South Korea), Minsung Kim (Suwon-si, South Korea), Dasom Lee (Suwon-si, South Korea), Heewon Min (Suwon-si, South Korea) and Dongyun Yeo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrostatic chuck includes a cooling plate having a cooling flow path, an insulating plate disposed on the cooling plate, an upper plate disposed on the insulating plate and fixed to the cooling plate, and a fastening member coupling the cooling plate to the upper plate. The fastening mem...