ALEXANDRIA, Va., Sept. 3 -- United States Patent no. 12,406,934, issued on Sept. 2, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Juhyeon Oh (Asan-si, South Korea), Sunchul Kim (Hwaseong-si, South Korea) and Hyunki Kim (Asan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate, a second substrate provided on the first substrate, a semiconductor chip provided between the first substrate and the second substrate, solder structures extending between the first substrate and the second substrate and spaced apart from the semiconductor chip, and bumps provided between the semiconductor chip ...