US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Wafer measurement apparatus and operating method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,736,488, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Wafer measurement apparatus and operating method thereof" was invented by Jaehyung Ahn (Suwon-si, South Korea), Inseok Park (Suwon-si, South Korea), Joonseo Song (Suwon-si, South Korea), Souk Kim (Suwon-si, South Korea) and Younghoon Sohn (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer measurement apparatus includes an electronic-optical system configured to irradiate a wafer with an electron beam and acquire a raw signal by detecting electrons emitted by the wafer, and an image processing device configured to convert the ra...