US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Substrate treatment apparatus and semiconductor device manufacturing method using the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,464, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate treatment apparatus and semiconductor device manufacturing method using the same" was invented by Woo Hyun Lee (Daejeon, South Korea), Su Ji Gim (Hwaseong-si, South Korea), Dong Jun Ka (Suwon-si, South Korea), Kyung Nam Kang (Hwaseong-si, South Korea), Hong Sik Park (Suwon-si, South Korea), Deok Cheon Son (Hwaseong-si, South Korea), Jeong Yeon Song (Hwaseong-si, South Korea) and Sun Hee Choy (Jeonju-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device manufacturing method comprising loading a substrate into a su...