US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Semiconductor package including an edge region having a plurality of solder balls therein" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,494, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including an edge region having a plurality of solder balls therein" was invented by Tong Suk Kim (Suwon-si, South Korea), Sang Woong Lee (Suwon-si, South Korea), Shle-Ge Lee (Suwon-si, South Korea), Seung Soo Ha (Suwon-si, South Korea) and Chang Ui Hong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package, including a first structure including a ball array region on a lower surface of the first structure and an external region completely surrounding the ball array region, the ball array regi...