US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Semiconductor device manufacturing method and semiconductor device manufactured using the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,173, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device manufacturing method and semiconductor device manufactured using the same" was invented by Jun Kyoung Lee (Suwon-si, South Korea), Tae Seong Kim (Suwon-si, South Korea), Ho-Jin Lee (Suwon-si, South Korea), Dong-Chan Lim (Suwon-si, South Korea) and Jae Won Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device manufacturing method that includes forming a lower chip and an upper chip, and bonding the lower chip and the upper chip to each other. The forming of t...