US Patent Issued to SAMSUNG ELECTRONICS on Sept. 15 for "Image sensor including stacked chips" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,740,176, issued on Sept. 15, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Image sensor including stacked chips" was invented by Jeongjin Lee (Seoul, South Korea), Jeongsoon Kang (Gumi-si, South Korea), Jihong Kim (Seoul, South Korea) and Changyong Um (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor includes a first lower chip, and an upper chip on and bonded to the first lower chip. The first lower chip and the upper chip collectively provide a plurality of pixels. A respective pixel of the plurality of pixels includes a photoelectric conversion element, a floating diffusion region, a ground r...