US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Slurry supply device, substrate polishing apparatus, and substrate polishing method" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,722,251, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Slurry supply device, substrate polishing apparatus, and substrate polishing method" was invented by Seungchul Lee (Hwaseong-si, South Korea), Dongil Kim (Hwaseong-si, South Korea), Hyunjoon Park (Suwon-si, South Korea), Kiju Sohn (Gunpo-si, South Korea) and Jonghun Pi (Gyeongsangbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A slurry supply device includes; a slurry distribution part configured to dispense slurry, and a support part connected to the slurry distribution part and configured to support the slurry distribution part. The sl...