ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,512, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Doyoung Jang (Suwon-si, South Korea), Eunsu Lee (Suwon-si, South Korea) and Daeyoung Jung (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate, a first semiconductor chip on the first substrate, and second semiconductor chips on the first substrate and adjacent sides of the first semiconductor chip, each of the second semiconductor chips has an elongated shape extending along one of the sides of the first semiconductor chip which is adjacent thereto, ...