US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,188, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device and method of fabricating the same" was invented by Beomjin Park (Suwon-si, South Korea), Myung Gil Kang (Suwon-si, South Korea), Dongwon Kim (Suwon-si, South Korea), Younggwon Kim (Suwon-si, South Korea), Sungkeun Lim (Suwon-si, South Korea), Soojin Jeong (Suwon-si, South Korea) and Yuyeong Jo (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a substrate that includes an active pattern; a channel pattern disposed on the active pattern, wherein the channel pattern includes a pluralit...