US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Integrated circuit device including a via power rail extending through device isolation film" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,466, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Integrated circuit device including a via power rail extending through device isolation film" was invented by Jeongyeon Seo (Suwon-si, South Korea), Sungwoo Kang (Suwon-si, South Korea), Hyonwook Ra (Suwon-si, South Korea) and Hongsik Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device includes a fin-type active region that extends from a substrate and in a first lateral direction, a device isolation film on a trench region on the substrate, an insulating liner structure that extends through the substrate...