US Patent Issued to SAMSUNG ELECTRONICS on Sept. 1 for "Image sensor chip and semiconductor package including the same" (South Korean Inventor)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,273, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Image sensor chip and semiconductor package including the same" was invented by Youngmin Yun (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, an image sensor chip on the package substrate, a transparent substrate on the image sensor chip, and a dam structure on an edge of the image sensor chip and between the image sensor chip and the transparent substrate. The image sensor chip includes a semiconductor substrate including a pixel array region and a pad region around the pixel array...