US Patent Issued to SAMSUNG ELECTRONICS on Oct. 6 for "Semiconductor packages having dummy posts" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,803, issued on Oct. 6, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor packages having dummy posts" was invented by Sanghyuck Oh (Suwon-si, South Korea), Seonghoon Bae (Suwon-si, South Korea) and Kwangok Jeong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package according to an example embodiment of the present disclosure comprises: a lower redistribution structure including an insulating layer, a connection pad disposed on an upper surface of the insulating layer, and an upper pad; a semiconductor chip mounted on the lower redistribution structure and connected to the uppe...