US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "System and method for modeling a semiconductor fabrication process" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,775,757, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"System and method for modeling a semiconductor fabrication process" was invented by Hyunjoong Kim (Seoul, South Korea), Jaepil Shin (Suwon-si, South Korea), Moonhyun Cha (Yongin-si, South Korea) and Changwook Jeong (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system for modeling a semiconductor fabrication process includes at least one first processor and at least one second processor. The at least one first processor is configured to provide at least one machine learning (ML) model, which is trained by using a plurality of pa...