US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Stack-type semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,659, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Stack-type semiconductor package" was invented by Kyung Don Mun (Suwon-si, South Korea), Jongyoun Kim (Suwon-si, South Korea) and Jaegwon Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a buffer die. One or more first semiconductor dies are stacked on the buffer die such that active surfaces face the buffer die. A second semiconductor die is stacked on the first semiconductor dies. The second semiconductor die includes a first layer and a second layer disposed thereon. The first layer includes a f...