ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,523, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Film forming apparatus" was invented by Jeonghyeon Lee (Suwon-si, South Korea) and Sangyub Ie (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A film forming apparatus, may include: a chamber having an internal space and an exhaust port; a wafer carrier disposed in the internal space of the chamber; a gas supply pipe disposed through the chamber; and an injector disposed in the internal space of the chamber and connected to the gas supply pipe, wherein the gas supply pipe may be connected to a central portion of the injector in a longi...