US Patent Issued to SAMSUNG ELECTRONICS on Oct. 27 for "Adhesive sheet and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,773,838, issued on Oct. 27, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Adhesive sheet and semiconductor package including the same" was invented by Dongkwan Kim (Hwaseong-si, South Korea) and Kunsil Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first substrate; a second substrate including a semiconductor element formed thereon; a film layer between the first substrate and the second substrate; and a molding member surrounding the second substrate, wherein the film layer includes a crystalline spherical silica filler distributed in a matrix."

The patent was f...