US Patent Issued to SAMSUNG ELECTRONICS on Oct. 14 for "Polypeptide, photoresist composition including the same, and method of forming pattern using the same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,769, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Gyeonggi-Do, South Korea).

"Polypeptide, photoresist composition including the same, and method of forming pattern using the same" was invented by Jieun Kim (Suwon-si, South Korea), Soonchun Chung (Seoul, South Korea), Jinha Kim (Hwaseong-si, South Korea) and Joonsong Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polypeptide including a region A, a region B, and a region C, a photoresist composition including the polypeptide, and a method of forming patterns by using the photoresist composition."

The patent was filed on May 11, 2022, under Applicati...