US Patent Issued to SAMSUNG ELECTRONICS on Oct. 14 for "Chip peeling apparatus and chip peeling method using the same" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,625, issued on Oct. 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Chip peeling apparatus and chip peeling method using the same" was invented by Tatsuya Ishimoto (Yokohama, Japan), Naoyuki Takada (Yokohama, Japan), Takahiro Tokumiya (Yokohama, Japan) and Masato Kajinami (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip peeling apparatus may include a peeling device. The peeling device may include a plurality of vacuum adsorption holes and a plurality of first air blow holes arranged around the plurality of vacuum adsorption holes. The peeling device may be configured to peel a chip off a tape when...