US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Systems and methods for AI-based multi-dimensional modulation shaping" (Canadian Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,786,036, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS COMPANY LTD. (Suwon City, South Korea).

"Systems and methods for AI-based multi-dimensional modulation shaping" was invented by Nuwan Suresh Ferdinand (Stittsville, Canada) and Sanjeewa Herath (Ottawa).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, a method includes accessing a stream of coded bits, generating multiple sub-streams of coded bits based on the accessed stream of coded bits, mapping the sub-stream of coded bits to multiple intermediate symbols, respectively, based on multiple respective bit-mapper models, generating multiple constellation symbols from the multip...