ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,784,955, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Inductor and semiconductor package including the same" was invented by Yukyung Park (Hwaseong-si, South Korea), Hyunjung Song (Hwaseong-si, South Korea) and Eunkyoung Choi (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inductor includes a semiconductor substrate provided with a plurality of wiring levels including a first wiring level and a second wiring level, a straight conductive line, at the first wiring level of the semiconductor substrate, having a first end, a conductive coil of a spiral pattern, at the second wiring level...