ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,401, issued on Nov. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Image sensor package" was invented by Kyongsoon Cho (Incheon, South Korea) and Ikjun Choi (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor package includes a first substrate portion including a first substrate and an upper wiring structure, the upper wiring structure including a stacked structure including a plurality of upper wiring patterns and a plurality of upper wiring vias. The image sensor package includes a second substrate portion including a second substrate and a lower wiring structure, the second substrate...