US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Semiconductor devices and methods of manufacturing semiconductor devices" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,621,989, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor devices and methods of manufacturing semiconductor devices" was invented by Eunyeoung Choi (Hwaseong-si, South Korea), Joonam Kim (Suwon-si, South Korea), Hyungjoon Kim (Yongin-si, South Korea), Donghwa Lee (Hwaseong-si, South Korea) and Dongsung Choi (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a semiconductor device includes forming a molded structure of stacked and alternating interlayer insulating layers and sacrificial layers on a lower structure, forming a hole through the molded structu...