US Patent Issued to SAMSUNG ELECTRONICS on May 5 for "Semiconductor device with multi-layer contact liner structure" (South Korean Inventors)

ALEXANDRIA, Va., May 5 -- United States Patent no. 12,622,017, issued on May 5, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device with multi-layer contact liner structure" was invented by Kyu-Hee Han (Suwon-si, South Korea), Bong Kwan Baek (Suwon-si, South Korea), Jung Hwan Chun (Suwon-si, South Korea), Koung Min Ryu (Suwon-si, South Korea), Jong Min Baek (Suwon-si, South Korea), Jung Hoo Shin (Suwon-si, South Korea), Jun Hyuk Lim (Suwon-si, South Korea) and Sang Shin Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device including an active pattern extended in a first direction, a plurality of gate structures in...