US Patent Issued to SAMSUNG ELECTRONICS on May 26 for "Device and method with multi-stage electrical interconnection network" (South Korean, American Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,040, issued on May 26, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Device and method with multi-stage electrical interconnection network" was invented by Wonseok Lee (Suwon-si, South Korea), Alan Gara (Palo Alto, Calif.), Young Jun Hong (Seoul, South Korea), Wonyong Lee (Seoul, South Korea) and Wooseok Chang (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device and method that implements a multi-stage electrical interconnection network is provided. The electronic device includes a plurality of computing devices and a plurality of switches grouped into a plurality of groups. Switches, of the plura...