US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Transfer method of aligning, placing, and bonding micro semiconductor chips on substrate" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,313, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Transfer method of aligning, placing, and bonding micro semiconductor chips on substrate" was invented by Hyunjoon Kim (Suwon-si, South Korea), Seogwoo Hong (Suwon-si, South Korea), Dongkyun Kim (Suwon-si, South Korea), Dongho Kim (Suwon-si, South Korea), Joonyong Park (Suwon-si, South Korea), Sanghoon Song (Suwon-si, South Korea), Kyungwook Hwang (Suwon-si, South Korea) and Junsik Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a method of transferring semiconductor chips. The method may include providing a first su...