US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Substrate processing apparatus and substrate processing method" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,631,967, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus and substrate processing method" was invented by Sangjine Park (Suwon-si, South Korea), Jihwan Park (Suwon-si, South Korea) and Kuntack Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a substrate processing apparatus including a processing chamber including a processing space, a substrate support configured to support a substrate in the processing chamber, an exhaust pipe arranged on a bottom wall of the processing chamber, an exhaust device configured to exhaust a fluid in the processing s...